книга Cooling Of Microelectronic and Nanoelectronic Equipment

А Б В Г Д Е Ж З И К Л М Н О П Р С Т У Ф Х Ц Ч Ш Щ Э Ю Я
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Cooling Of Microelectronic and Nanoelectronic Equipment

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Название: Cooling Of Microelectronic and Nanoelectronic Equipment
Автор: Madhusudan Iyengar
Страниц: 400
Формат: PDF
Размер: 28.4 Мб
Качество: Отличное
Язык: Английский
Год издания: 2015


To celebrate Professor Avi Bar-Cohen's 65th birthday, this unique volume is a collection of recent advances and emerging research from various luminaries and experts in the field.Cutting-edge technologies and research related to thermal management and thermal packaging of micro- and nanoelectronics are covered, including enhanced heat transfer, heat sinks, liquid cooling, phase change materials, synthetic jets, computational heat transfer, electronics reliability, 3D packaging, thermoelectrics, data centers, and solid state lighting.
This book can be used by researchers and practitioners of thermal engineering to gain insight into next generation thermal packaging solutions. It is an excellent reference text for graduate-level courses in heat transfer and electronics packaging.


Contents

Dedication v
1. A Review of Cooling Road Maps for 3D Chip Packages 1
Dereje Agonafer
2. Thermal Performance Mapping of Direct Liquid
Cooled 3D Chip Stacks 19
Karl J.L. Geisler and Avram Bar-Cohen
3. Dynamic Thermal Management Considering Accurate
Temperature-Leakage Interdependency 43
Bing Shi and Ankur Srivastava
4. Energy Reduction and Performance Maximization
Through Improved Cooling 69
David Copeland
5. Optimal Choice of Heat Sinks from an Industrial Point of View 83
Clemens J.M. Lasance
6. Synthetic Jets for Heat Transfer Augmentation in
Microelectronics Systems 125
Mehmet Arik and Enes Tamdogan
7. Recent Advance in Thermoelectric Devices for Electronics Cooling 167
Peng Wang
8. Energy Efficient Solid-State Cooling for Hot Spot Removal 195
Kazuaki Yazawa, Andrei Fedorov, Yogendra Joshi
and Ali Shakouri
9. An Overview of the Use of Phase Change Materials for the
Thermal Management of Transient Portable Electronics:
Benefits and Challenges 227
Amy S. Fleischer
10. Estimation of Cooling Performance of Phase Change
Material (PCM) Module 243
Masaru Ishizuka and Tomoyuki Hatakeyama
11. Optimization Under Uncertainty for Electronics Cooling Design 267
Karthik K. Bodla, Jayathi Y. Murthy and Suresh V. Garimella
12. Hydrophilic CNT-Sintered Copper Composite Wick
for Enhanced Cooling 307
Glen A. Powell, Anuradha Bulusu, Justin A. Weibel,
Sungwon S. Kim, Suresh V. Garimella and Timothy S. Fisher
13. A Cabinet Level Thermal Test Vehicle to Evaluate Hybrid
Double-Sided Cooling Schemes 333
Qihong Nie and Yogendra Joshi
14. Energy Efficiency and Reliability Risk Mitigation of Data
Centers Through Prognostics and Health Management 357
Jun Dai, Michael Ohadi and Michael Pecht
15. Damage Pre-Cursors Based Assessment of Accrued Thermomechanical
Damage and Remaining Useful Life in Field
Deployed Electronics 377
Pradeep Lall, Mahendra Harsha, Kai Goebel and Jim Jones
16. Towards Embedded Cooling - Gen 3 Thermal Packaging Technology 421
Avram Bar-Cohen
Index 459


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